| 摘要 |
PURPOSE:To improve reliability, by forming a film, whose adhesion to a sealing resin is not high, on the rear surface of an island, on which an IC chip is mounted, and providing a vent hole in the sealing resin in a film forming region. CONSTITUTION:An IC chip 13 is die-bonded on one surface of an island 12. A film 17, which comprises an Au plated layer and has low adhesion, is formed on the other surface. Electrodes (not shown) on the surface of the IC chip and a lead frame 11 are connected with thin metal wires 14 comprising Au wires. The IC chip and a part of the lead frame are packaged with a molding resin 15 as a unitary body. At this time, a vent hole 18 is provided at a place corresponding to the film 17. Even if moisture, which has intruded in the package due to heating at the time of soldering and the like, is evaporated, the moisture is discharged to the outside by way of the vent hole 18. Therefore, the yield of cracks in the package can be prevented. |
