PHOTODETECTOR ARRAY AND METHOD OF MANUFACTURE

摘要

The present invention is directed to photodiode arrays comprising a dielectric structure containing an array of face conductive areas (pads) and. Each photodiode is fully separated from each other. Every photodiode has a face electrode formed on sensitive side of the semiconductor substrate and an individual back electrode formed on the opposite side. The number of conductive areas on the dielectric structure is equal to number of photodiodes in the array. The photodiodes of the array are installed on the conductive areas so that their back electrodes have electrical contact with the corresponding conductive area. Each conductive area contains at least one individual conductive hole penetrating the dielectric package from the face side to the opposite side of the dielectric structure. The conductive holes going to backside of the dielectric structure are connected with the back conductive areas formed on back side of dielectric package.

主权项

1. An avalanche photodetector array, comprising:
a dielectric structure formed on a substrate; a matrix of front side conductive areas positioned on a front side of the substrate, wherein each front side conductive area is separated from each other front side conductive area; a matrix of corresponding front side photo-detector elements positioned on the matrix of front side conductive areas, wherein each front side photo-detector element is separated from each other front side photo-detector element; a confronting matrix of back side conductive areas positioned on a back side of the substrate opposite from the matrix of front side conductive areas, wherein each back side conductive area is separated from each other back side conductive area, and wherein each back side conductive area is electrically connected to each corresponding front side conductive area by way of at least one interconnecting conductive area through-hole; at least one front side conductive strip positioned on the front side of the substrate and adjacent to the matrix of front side conductive areas; at least one back side conductive strip positioned on the back side of the substrate and adjacent to the matrix of back side conductive areas, wherein the at least one back side conductive strip is electrically connected to the at least one front side conductive strip, and wherein the at least one front side conductive strip and each front side conductive area are electrically interconnected to one another.