发明名称 LASER MACHINING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a laser machining apparatus which can detect a position of a workpiece with high accuracy in edge detection by image analysis.SOLUTION: A laser machining apparatus 100 includes laser irradiating means 1 which irradiates a laser beam L to a workpiece w, stage means 2 which is movable in a state of holding the workpiece w, and edge detection means 3 which performs position detection of the workpiece w by edge detection using image analysis. The edge detection means 3 includes imaging means 31 for image photographing, illumination means 32 which illuminates an imaging range A of the imaging means 31, a reflecting plate 33 which is arranged in a state where the workpiece w is interposed between the reflecting plate 33 and the imaging means 31, and reflects illumination light S to irradiate the light S to the workpiece w from its back, a reflecting surface cleaning mechanism which can replace the surface of the reflecting plate 33 in the imaging range A with a newly formed surface, and image processing means 36 which detects an edge position of the workpiece w from an image obtained by the imaging means 31.
申请公布号 JP2014121727(A) 申请公布日期 2014.07.03
申请号 JP20120280039 申请日期 2012.12.21
申请人 MITSUBISHI MATERIALS CORP 发明人 HIGANO SATORU;TAKAHASHI MASAKUNI;KUBO TAKUYA
分类号 B23K26/02;B23K26/00;B23K26/16;G01B11/00 主分类号 B23K26/02
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