| 摘要 |
PROBLEM TO BE SOLVED: To provide a small semiconductor module which reduces inductance.SOLUTION: A semiconductor module according to the invention comprises: circuit patterns 1c provided on one main surface of a substrate 1; semiconductor elements 3 joined onto the circuit patterns 1c; and metal plates 5 which join the circuit patterns 1c with the semiconductor elements 3 and/or join the semiconductor element 3 with another semiconductor element 3. The substrate 1, the circuit patterns 1c, the semiconductor elements 3, and the metal plates 5 are sealed by a resin 6. Holes 6a are formed in the resin 6. Parts of the circuit patterns 1c, the semiconductor elements 3, or the metal plates 5 are exposed from the holes 6a in a plane view. |
