| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component manufacturing method which can form an electromagnetic shield layer having high adhesion to an electronic component; and sufficiently inhibit deterioration in the electronic component itself; and which requires no complicated process.SOLUTION: An electronic component manufacturing method comprises: a process of preparing a semiconductor mounting substrate including a base material, a semiconductor element arranged on one surface of the base material and an encapsulation material for encapsulating the semiconductor element; a process of attaching a protective film to the other surface of the base material; a process of performing a blast treatment on a surface of the encapsulation material; and a process of forming an electroless plating film on the surface of the encapsulation material which is subject to the blast treatment. |
