| 发明名称 |
DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD |
| 摘要 |
A defect inspection device of the present invention for detecting a position of a defect existing in a wire formed on a panel, includes: a probe which applies a voltage to a terminal section of the wire; probe moving means for moving the probe to the terminal section; a first infrared sensor which photographs an entire surface of the panel; a second infrared sensor which photographs a part of the panel; and sensor moving means for moving the second infrared sensor to each position on the panel, the first infrared sensor including a plurality of infrared cameras. |
| 申请公布号 |
US2014184784(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201214126016 |
申请日期 |
2012.05.18 |
| 申请人 |
Yanase Masakazu |
发明人 |
Yanase Masakazu |
| 分类号 |
G01N21/88;H04N5/33 |
主分类号 |
G01N21/88 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A defect inspection device for detecting a position of a defect existing in a wire formed on a panel, comprising:
a probe which applies a voltage to a terminal section of the wire; probe moving means for moving the probe to the terminal section; a first infrared sensor which photographs an entire surface of the panel; a second infrared sensor which photographs a part of the panel; and sensor moving means for moving the second infrared sensor to each position on the panel, the first infrared sensor including a plurality of infrared cameras. |
| 地址 |
Osaka-shi JP |
