| 发明名称 |
COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING |
| 摘要 |
A copper electroplating solution which contains compounds with the structure —X—S—Y— wherein X and Y are, independently atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and ninhydrin. By using this copper electroplating solution, it is possible to form good filled vias without worsening the appearance of the plating. |
| 申请公布号 |
US2014183052(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201213727627 |
申请日期 |
2012.12.27 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
SAITO Mutsuko;SAKAI Makoto;MORINAGA Toshiyuki;HAYASHI Shinjiro |
| 分类号 |
C25D3/38 |
主分类号 |
C25D3/38 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A copper plating solution which contains compounds with the structure —X—S—Y— wherein X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and ninhydrin. |
| 地址 |
Marlborough MA US |
