ADHESIVE COMPOSITION, CIRCUIT CONNECTING ADHESIVE, AND CONNECTION BODY

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition which exhibits sufficient adhesiveness even when cured at a low temperature in a short time, has high connection reliability even after exposure of a connection body to high-temperature and high-humidity conditions for a long time, and is excellent in storage stability.SOLUTION: The adhesive composition contains: (a) a thermoplastic resin; (b) a radically polymerizable compound which has two or more (meth)acryloyl groups and two or more urethane bonds in one molecule and has a weight-average molecular weight greater than 30,000 and not greater than 50,000; (c) a radical polymerization initiator; and a tri- or higher functional (meth)acrylate other than (b) the radically polymerizable compound.