发明名称 |
SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE HAVING METAL MEMBER, POWER MODULE HAVING METAL MEMBER, METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE HAVING METAL MEMBER |
摘要 |
This substrate for a power module is provided with an insulation layer (11), a circuit layer (12) formed on the first surface of the insulation layer, and a metal layer (13) formed on the second surface of the insulation layer. A first base layer (20) is layered on the surface of the metal layer on the opposite side to the surface at which the insulation layer is installed. The first base layer has a first glass layer formed on the interface with the metal layer and a first Ag layer layered on the first glass layer. |
申请公布号 |
WO2014103965(A1) |
申请公布日期 |
2014.07.03 |
申请号 |
WO2013JP84373 |
申请日期 |
2013.12.20 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
NISHIMOTO SHUJI;NAGATOMO YOSHIYUKI |
分类号 |
H01L23/36;H01L23/40;H05K1/02 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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