MODULE WITH LIGHT-EMITTING DIODES

摘要

A light emitting module (10) comprises a substrate plate (1); a plurality of light emitting semiconductor chips (2) placed on the substrate plate; and a continuous encapsulation (5) on the substrate plate encapsulating the light emitting semiconductor chips, the encapsulation comprising a convex lens portion (7) above each semiconductor chip. According to the present invention, in a cross-section of the encapsulation along a plane passing the middle points of two adjacent semiconductor chips, the surface of the convex lens portion has a curvature of radius Rlens meeting the condition W≤Rlens≤2W, wherein W is the width of the semiconductor chips, and the convex lens portions of the adjacent semiconductor chips are connected via a concave combining portion (8), the surface of which has a curvature of radius Rcomb≤Rlens.