Electronic device sealing for a downhole tool

摘要

Systems, methods, and devices that have a hermetic seal formed using reflow soldering are provided. The hermetic seal may protect electrical components within a packaging for use in downhole tools and/or other applications where the electrical components may be exposed to extreme environments. In one example, an electronic device includes a ceramic substrate having a plated ring. The electronic device also includes a metal lid. A high-temperature solder is disposed between the plated ring of the ceramic substrate and the metal lid. The electronic device includes a hermetically sealed cavity formed between the ceramic substrate and the metal lid. The hermetically sealed cavity is formed via a first bond between the plated ring of the ceramic substrate and the high-temperature solder, and via a second bond between the metal lid and the high-temperature solder. Moreover, the first and second bonds are formed using reflow soldering.