发明名称 SPUTTERING APPARATUS AND METHOD
摘要 A deposition apparatus for depositing a layer of deposition material on a substrate is provided. The apparatus includes a substrate support adapted for holding the substrate; a target support (520) adapted for holding a target assembly. The target assembly includes a backing element and at least two target elements (510, 511) arranged on the backing element next to each other so that a gap (530) is formed between the at least two target elements. The gap between the target elements is to have a width (w). Further, the substrate support and the target support are arranged with respect to each other so that the ratio of distance between substrate and target (570) element to the gap width (w) is about 150 and greater.
申请公布号 EP2748351(A1) 申请公布日期 2014.07.02
申请号 EP20110760421 申请日期 2011.08.25
申请人 APPLIED MATERIALS, INC. 发明人 SCHEER, EVELYN;GRAW, OLIVER
分类号 C23C14/34;H01J37/34 主分类号 C23C14/34
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