| 摘要 |
In a method of fabricating a printed circuit board (PCB) according to one embodiment, a carrier substrate including a dummy insulating layer is prepared. A photosensitive film layer and a solder resist layer are sequentially formed on the carrier substrate. A via hole is formed by passing through the photosensitive film layer and the solder resist layer. A connection bump layer filling at least the via hole is formed in a plating scheme. A circuit pattern layer is laminated on the connection bump layer to form a first lamination structure. A second lamination structure including the connection bump layer and the circuit pattern layer is formed by removing the carrier substrate from the first lamination structure. The connection bump layer is partially exposed on the solder resist layer by removing the photosensitive film layer from the second lamination structure. |
