Light emitting diode chip, and methods for manufacturing and packaging the same

摘要

A light emitting diode chip includes a substrate, an epitaxial layer, two inclined plane units, and two electrode units. The substrate has top and bottom surfaces. The epitaxial layer is disposed on the top surface of the substrate. Each of the inclined plane units is inclined downwardly and outwardly from the epitaxial layer toward the bottom surface of the substrate, and includes an inclined sidewall formed on the epitaxial layer, and a substrate inclined wall formed on the substrate. Each of the electrode units includes an electrode disposed on the epitaxial layer, and a conductive portion extending from the electrode to the substrate inclined wall along corresponding one of the inclined plane units.

主权项

1. A package structure, comprising:
a package substrate having a reflective cup formed therein, said reflective cup having a cup bottom and a cup wall defining a periphery of said cup bottom, said cup wall extending upwardly from said cup bottom to terminate at an upper peripheral edge of said reflective cup, said upper peripheral edge of said reflective cup being lower than an upper surface of said package substrate; a light emitting diode chip having a lower surface mounted onto said cup bottom in spaced relationship from said cup wall; two conductive pieces disposed on an upper surface of said light emitting diode chip and spaced one from the other, said two conductive pieces extending upwardly beyond said reflective cup and respectively serving as connections to said light emitting diode chip; and a light-transmissive encapsulant disposed in said reflective cup to encapsulate said light emitting diode chip and a major part of each of said conductive pieces so as to permit an uppermost surface region of each of said conductive pieces to be exposed from and be flush with an upper surface of said light-transmissive encapsulant for electrical connection thereto.