| 发明名称 | Electronic device | ||
| 摘要 | A mobile phone that is an electronic device includes a bottom housing including a first bottom subhousing. On the first bottom subhousing a rib is provided so as to surround a position where an earphone jack is to be provided and be in with a substrate on which the earphone jack is to be provided. This rib prevents liquid from infiltrating into the bottom housing. Connection terminals of the earphone jack are each connected with other components of the mobile phone such as a CPU via an inner layer of the substrate. | ||
| 申请公布号 | US8767406(B2) | 申请公布日期 | 2014.07.01 |
| 申请号 | US201013146628 | 申请日期 | 2010.01.22 |
| 申请人 | KYOCERA Corporation | 发明人 | Otani Masayuki |
| 分类号 | H05K5/00;H05K5/04;H05K5/06 | 主分类号 | H05K5/00 |
| 代理机构 | Procopio, Cory, Hargreaves & Savitch LLP | 代理人 | Procopio, Cory, Hargreaves & Savitch LLP |
| 主权项 | 1. An electronic device comprising: a substrate; and an interface unit provided on the substrate; and, a housing including an opening and a partitioning part, the partitioning part extending to the substrate, and the partitioning part further extending from the opening around the interface unit such that the interface unit is surrounded by the partitioning part from the opening and the interface unit is exposed at the opening; wherein the partitioning part is a rib provisioned in the housing, the rib is in contact with the substrate, and bonded to the substrate. | ||
| 地址 | Kyoto JP | ||