发明名称 |
Carrier film for mounting polishing workpiece and method for making the same |
摘要 |
The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate consists of first elastomer, the first elastomer comprising a plurality of first holes; wherein the first holes have a drop shape, and each of the first holes has an opening. The buffer substrate consists of second elastomer, the second elastomer comprising a plurality of second holes. The surface substrate and the buffer substrate are adhered with adhesive comprising the first or the second elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece. |
申请公布号 |
US8765259(B2) |
申请公布日期 |
2014.07.01 |
申请号 |
US201012907382 |
申请日期 |
2010.10.19 |
申请人 |
San Fang Chemical Industry Co., Ltd. |
发明人 |
Feng Chung-Chih;Yao I-Peng;Wang Lyang-Gung;Hung Yung-Chang |
分类号 |
B24B41/06;B32B37/12;B29C65/00;B24B19/00;C09J5/06 |
主分类号 |
B24B41/06 |
代理机构 |
WPAT, P.C. |
代理人 |
WPAT, P.C. ;King Anthony;Yang Kay |
主权项 |
1. A polishing device comprising:
a base plate; a carrier film adhered to the base plate for mounting a polishing workpiece in a process of chemical mechanical polishing, comprising: a surface substrate consisting of first elastomer, the first elastomer comprising a plurality of first holes; wherein the plurality of first holes have a drop shape, and each of the plurality of first holes has an opening, a buffer substrate consisting of second elastomer, the second elastomer comprising a plurality of second holes; wherein the surface substrate and the buffer substrate are adhered with adhesive comprising the first or the second elastomer; wherein the first elastomer and the second elastomer are the same and are polyurethane; a polishing workpiece mounted by the carrier film; and a polishing pad placed against the polishing workpiece and polishing the polishing workpiece in the process of chemical mechanical polishing. |
地址 |
Kaohsiung TW |