发明名称 Carrier film for mounting polishing workpiece and method for making the same
摘要 The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate consists of first elastomer, the first elastomer comprising a plurality of first holes; wherein the first holes have a drop shape, and each of the first holes has an opening. The buffer substrate consists of second elastomer, the second elastomer comprising a plurality of second holes. The surface substrate and the buffer substrate are adhered with adhesive comprising the first or the second elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece.
申请公布号 US8765259(B2) 申请公布日期 2014.07.01
申请号 US201012907382 申请日期 2010.10.19
申请人 San Fang Chemical Industry Co., Ltd. 发明人 Feng Chung-Chih;Yao I-Peng;Wang Lyang-Gung;Hung Yung-Chang
分类号 B24B41/06;B32B37/12;B29C65/00;B24B19/00;C09J5/06 主分类号 B24B41/06
代理机构 WPAT, P.C. 代理人 WPAT, P.C. ;King Anthony;Yang Kay
主权项 1. A polishing device comprising: a base plate; a carrier film adhered to the base plate for mounting a polishing workpiece in a process of chemical mechanical polishing, comprising: a surface substrate consisting of first elastomer, the first elastomer comprising a plurality of first holes; wherein the plurality of first holes have a drop shape, and each of the plurality of first holes has an opening, a buffer substrate consisting of second elastomer, the second elastomer comprising a plurality of second holes; wherein the surface substrate and the buffer substrate are adhered with adhesive comprising the first or the second elastomer; wherein the first elastomer and the second elastomer are the same and are polyurethane; a polishing workpiece mounted by the carrier film; and a polishing pad placed against the polishing workpiece and polishing the polishing workpiece in the process of chemical mechanical polishing.
地址 Kaohsiung TW