Electrochemical device and packaging structure thereof

摘要

Provided is an electrochemical device which is compatible with high-temperature reflow soldering using lead-free solder. An electric double-layer capacitor 10-1 has a structure in which a positive terminal 12 and a negative terminal 13 are led out of a package 14 where an electric storage element 11 is sealed. The entire package 14 and the bases of led-out portions of the positive terminal 12 and the negative terminal 13 are covered by a thermal insulation material layer 16 having a thermal conductivity lower than that of the package 14.

主权项

1. An electrochemical device which is mounted by soldering for use, comprising: a package; an electric storage element which is sealed into the package; at least a pair of terminals, each having one end which is electrically connected to the electric storage element and another end which is led out of the package; and heat transfer suppressing means which covers the entire package and bases of led-out portions of the terminals so as to suppress heat transfer from the outside to the package,
wherein the heat transfer suppressing means includes a cover sheet which covers the package, and an air layer which is disposed between the cover sheet and the package and configured to cover the entire surface of the package.