发明名称 Nonvolatile memory device and method for manufacturing same
摘要 According to one embodiment, a nonvolatile memory device includes a selection element layer and a nanomaterial aggregate layer. The selection element layer includes silicon. The nanomaterial aggregate layer is stacked on the selection element layer. The nanomaterial aggregate layer includes a plurality of micro conductive bodies and fine particles dispersed in a plurality of gaps between the micro conductive bodies. At least a surface of the fine particle is made of an insulating material other than silicon oxide.
申请公布号 US8765565(B2) 申请公布日期 2014.07.01
申请号 US201313937906 申请日期 2013.07.09
申请人 Kabushiki Kaisha Toshiba 发明人 Aoyama Kenji;Yamamoto Kazuhiko;Ishikawa Satoshi;Oshino Shigeto
分类号 H01L21/02;H01L21/20 主分类号 H01L21/02
代理机构 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A method for manufacturing a nonvolatile memory device, comprising: forming a stacked body including a nanomaterial aggregate layer stacked with a selection element layer including silicon, the nanomaterial aggregate layer including a plurality of micro conductive bodies and fine particles dispersed in a plurality of gaps between the micro conductive bodies, at least a surface of the fine particle being made of an insulating material other than silicon oxide; forming a pillar by selectively removing the stacked body; and removing a by-product adhered to a side face of the pillar by using a chemical liquid providing a higher dissolution rate of the by-product than of the insulating material.
地址 Minato-ku JP