| 摘要 |
The invention relates to a to-be-processed object disjunction method and a disjunction method for substrate provided with optical element pattern. The invention provides a technique of breaking to-be-processed object made of fragile material with high precision and high efficiency. The to-be-processed object disjunction method includes the following steps: forming chalk lines on a line chalking face through emitting a first laser on the line chalking face of the to-be-processed object; and heating the to-be-processed object along the chalk line through emitting second laser along the chalk line from a side of a non-line-chalking face. In the later step, opposite scanning of the second laser is realized in a state that the line chalking surface is contacted with cooling medium, so that a drawing stress field near the chalk line and in the to-be-processed object is moved and cooled. Therefore, a crack is produced in sequence along the chalk line caused for making the chalk line in the drawing stress field, so that the to-be-processed object is cut off. |
