| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device production process of which is prevented from being complicated.SOLUTION: A semiconductor device having leads (10), wires (20) connected electrically with the leads, and a coating resin (30) for covering and protecting all wires and some leads further includes at least one disconnection preventing wire (40) for suppressing occurrence of poor electrical connection of the wire and lead. The disconnection preventing wire is joined to the lead and covered and protected by a coating resin. The joint (41) of the disconnection preventing wire with the lead is located at least between the corner (11) of the lead covered with the coating resin and the connection (21) of the wire with the lead, or between an end face (12) of the lead covered with the coating resin and located at shortest distance to the connection and the connection. |
