| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem with a thermal sensor formed by a mold resin having an opening, in which peel-off occurs on a low-adhesive interface due to a residual stress of the mold resin at the opening.SOLUTION: A physical quantity sensor comprises: a semiconductor chip that includes a detection section 3; a frame 8a where a semiconductor chip is mounted; a mold resin section 10 that seals the semiconductor chip and frame, and includes an opening which makes the detection section exposed to the outside; and a stress absorbing layer 6 that is provided between an end part of the opening of the mold resin section and a wiring layer formed in the detection section, and that is formed of a metal material that absorbs the stress from the end part. |
