BUMP FORMING DEVICE AND METHOD, WIRING FORMATION DEVICE AND METHOD, AND WIRING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a bump forming device which forms a fine bump on a work piece.SOLUTION: A bump forming device which forms a bump on a work piece using an electrostatic application includes: a nozzle which applies to a work piece a solution which serves as a bump's materials by applying pulse voltage; and a control means controls to form a bump in the work piece using particles of the solution.