| 摘要 |
<p>The present invention relates to a substrate processing system and, more specifically, a substrate processing system which processes a substrate while moving a substrate carrier after having the substrate placed on the substrate carrier. A substrate carrier of the substrate processing system according to the present invention, which moves a substrate fixed by an electrostatic chuck using electrostatic force to fix the substrate, comprises a carrier body moving along a transfer pathway installed on the substrate processing system; a ground contact unit installed on the carrier body and grounded by being electrically connected to a ground connection unit installed on the transfer pathway; the electrostatic chuck installed on the carrier body to form the upper surface of the carrier body and having an electrode electrically connected to the ground contact unit; a power supply unit combined with the carrier body and supplying DC power to the electrostatic chuck; and at least one switch unit installed on the carrier body and making the power supply unit selectively supply power to the electrostatic chuck.</p> |
