发明名称 |
LAMINATED BODY, LAMINATED PLATE, MULTILAYER LAMINATED PLATE, PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING LAMINATED PLATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a laminated plate which solves such a problem that in a laminated plate including a cured resin layer and a glass substrate layer, when a resin composition layer is thick, the glass substrate cannot withstand the thermal expansion force of the resin composition layer and cracks at laminating and cutting; and hardly causes cracks, even when the cured resin layer is thick.SOLUTION: In a laminated body including one or more resin composition layers and one or more glass substrate layers, the resin composition layer is formed of a resin composition including a thermosetting resin and an inorganic filler or a resin composition including the thermosetting resin and a fiber base material, and the glass substrate layer has a thickness of 30-250 μm and is a glass substrate manufactured by a floating method. A laminated plate is obtained by heating and molding the laminated body, and a printed wiring board has a laminated plate provided with a circuit. |
申请公布号 |
JP2014120689(A) |
申请公布日期 |
2014.06.30 |
申请号 |
JP20120276260 |
申请日期 |
2012.12.18 |
申请人 |
HITACHI CHEMICAL CO LTD |
发明人 |
YAMAZAKI YUKA;AOSHIMA MASAHIRO;KAMIGATA YASUO;MURAI HIKARI |
分类号 |
H05K3/46;B32B17/10;B32B27/20 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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