RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD

摘要

The present invention provides a resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a tetraphenylethane curing agent; an insulating film and a prepreg manufactured using the resin composition; and a printed circuit board including the insulating film or the prepreg. The resin composition for the printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same have low coefficient of thermal expansion, excellent heat resistance and a high glass transition temperature.