| 摘要 |
In a stacked layer type semiconductor package (400; 600) constructed by stacking a plurality of packages (100) with each other, the plurality of packages include a semiconductor package including: a semiconductor chip (301) ; a substrate in which a concave portion (101A) has been formed, the semiconductor chip being mounted in the concave portion; and a wiring line structure (200) constructed in such a manner that the wiring line structure can be externally connected to the semiconductor chip at least just above and just under the semiconductor chip. |
