| 摘要 |
FIELD: electricity.SUBSTANCE: invention relates to the field of thermal electricity. The invention concept is as follows: insulating substrate (12) is equipped with the first (18) and second (20) junction areas. At the substrate (12) there is the first formed assembly of conductor or semiconductor elements (14) passing in parallel and in the first direction from the first (18) junction area up to the second (20) one. At the other side of the substrate (12) there is the second assembly of or semiconductor elements (22) insulated electrically from the first assembly and passing in the direction opposite from the first direction, from the first junction area (18) up to the second (20) one. In the junction areas (18, 20) the electrical connecting elements (24) connect the elements (14) and (22) of the first and second assemblies. Two elements (14, 22) of the same assembly are separated in preset direction at the preset average distance (d1, d2) in the junction areas (18, 20). The average size (P) of the connecting elements (24) in the preset direction is bigger than a maximum value of average distances (d1, d2) between elements of the same assembly. The distance (E) in the preset direction between edges of two connecting elements (24) is less than minimum values of average distances (d1, d2) between elements of the same assembly.EFFECT: simplifying the construction and improving reliability.6 cl, 6 dwg |
