LED CHIP WITH PHOSPHOR SHEET AND METHOD FOR MANUFACTURING THE SAME

摘要

The objective of the present invention is to provide an LED chip with a phosphor sheet and a method for manufacturing the same, capable of reducing color temperature scattering and a defective due to phosphor dotting in a package process by installing a phosphor sheet on the backside of a growth substrate in an LED wafer step. To achieve the objective, the LED chip with a phosphor sheet comprises: an n-type semiconductor layer formed on the upper surface of a growth substrate; an active layer formed on the n-type semiconductor layer; a p-type semiconductor layer formed on the active layer; a reflective electrode layer formed on the p-type semiconductor layer; a p-type electrode formed on the reflective electrode layer; an n-type electrode formed on the n-type semiconductor layer which is exposed by etching the active layer, the p-type semiconductor layer, and the reflective electrode layer; a protective layer to protect the reflective electrode layer, the n-type semiconductor layer which is etched and exposed, the active layer, and the p-type semiconductor layer; and a phosphor sheet formed on the backside of the growth substrate. The phosphor sheet is installed on the backside of the growth substrate in the LED wafer step, thereby reducing color temperature scattering and a defective due to phosphor dotting in a package process, simplifying processes by installing the phosphor sheet in a wafer state, and adjusting the LED chip according to the change in the color temperature by adjusting density and uniformity of the phosphor in the phosphor sheet.