METHOD FOR DISPENSING GLUE ON LED CHIP

摘要

A method for dispensing glue on an LED chip includes following steps: providing a glue dispensing device which includes a syringe, a needle head communicating with the syringe, and a valve mounted on the needle head for controlling flowing of content in the syringe out of the syringe, wherein the valve has an aperture, and a diameter of the aperture is adjustable; providing glue and injecting the glue into the syringe; providing an LED chip which is mounted a circuit board and orientating the needle head of the glue dispensing device towards the LED chip, wherein the needle head is spaced from the LED chip, and the diameter of the aperture of the valve is adjusted to a predetermined size; squeezing the glue out of the syringe under a predetermined pressure and a predetermined time, wherein the glue dispensed on the LED chip forms an encapsulation structure.

主权项

1. A method for dispensing glue on an LED (light emitting diode) chip, comprising following steps:
providing a glue dispensing device, the glue dispensing device comprising a syringe, a needle head communicating with the syringe, and a valve connected on the needle head, the valve having an aperture, a diameter of the aperture being adjustable; providing glue and injecting the glue into the syringe; providing an LED chip which is mounted on a substrate and orientating the needle head of the glue dispensing device towards the LED chip, the needle head being spaced from the LED chip, the diameter of the aperture of the valve being adjusted to a predetermined size; and squeezing the glue out of the syringe through the valve under a predetermined pressure and a predetermined time to the LED chip, the glue dispensed on the LED chip forming an encapsulation structure, the encapsulation structure having a curved top face and a planar bottom face.