| 摘要 |
<p>The invention relates to a method for the manufacture of a printed circuit board (20) that includes a real wood ply (11), with the method comprising the steps for producing a real wood ply composite material (10) that includes a real wood ply (11) and a synthetic resin (12), providing one or more pre-pregs (21), applying a copper foil to one or both sides of the real wood ply composite material and/or applying a copper foil to one or both sides of at least one pre-preg, patterning the copper foil or copper foils to form one or more conductive structures (22) and forming electrically conductive connections between conductive structures formed from different copper foils as appropriate, pressing the real wood ply composite material (10) and the one or more pre-pregs together for forming a composite printed circuit board, and at least partially curing the synthetic resin portions of the real wood ply composite material and the pre-preg (s). The step for producing a real wood ply composite material (10) hereby comprises substeps for providing a real wood ply (S1, S1*), impregnating the real wood ply (11) with a fluid synthetic resin (S2, S4*), and placing the real wood ply (11) in a receptacle (S3, S2*) and creating a negative pressure in the receptacle (S4, S3*).</p> |
