| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing device, a laser processing system and a laser processing method, capable of cutting a thick workpiece.SOLUTION: A laser processing device 1 of an embodiment is a laser processing device for processing a processing object 2 by irradiating a laser L to the processing object 2 with a water flow W as a light guide material, and comprises: an ultrasonic vibrator 16 for preventing liquid in a cutting groove 28 generated in the processing object 2 by cutting work from staying around a liquid flow jetted in the cutting groove 28. The laser processing system 1 of an embodiment is a laser processing system for executing the cutting work by irradiating the laser L to the processing object 2 with the water flow W as the light guide material, and comprises: the staying preventive ultrasonic vibrator 16; cutting depth measuring means 18; and a control part 19 for controlling the ultrasonic vibrator 16 based on the cutting depth. A laser processing method of an embodiment is a laser processing method for executing the cutting work by irradiating the laser L to the processing object 2 with the water flow W as the light guide material, and prevents the liquid from staying around the liquid flow in the cutting groove 28 by the ultrasonic vibrator 16. |
