发明名称 |
Structural adhesive compositions |
摘要 |
Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. |
申请公布号 |
AU2012347650(A1) |
申请公布日期 |
2014.06.26 |
申请号 |
AU20120347650 |
申请日期 |
2012.12.07 |
申请人 |
PPG INDUSTRIES OHIO, INC. |
发明人 |
DESAI, UMESH C.;CHAO, TIEN-CHIEH;NAKAJIMA, MASAYUKI;RAGUNATHAN, KALIAPPA G. |
分类号 |
B82Y30/00;C08G59/18;C08G59/22;C08G59/40;C08G59/42;C08G59/50;C08K3/04;C09J163/00 |
主分类号 |
B82Y30/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|