发明名称 METHOD FOR EXAMINING QUALITY OF METAL WIRE BONDING IN REAL TIME
摘要 Disclosed is a method for examining the quality of metal wire bonding in real time which performs wire bonding in an ultrasonic bonding scheme and tests the efficiency of a bonding operation to determine whether the quality of the bonding operation is excellent or bad. The method for examining the quality of metal wire bonding in real time includes the steps of: adhering a metal wire to a bonding pad by pressing a bonding part of the metal wire using a bonding tool; bonding the bonding part of the metal wire to the bonding pad by vibrating the bonding tool at an ultrasonic wave frequency band; detecting a section modification value of the bonding part bonded to the bonding pad; and determining that bonding quality is bad when the section modification value is less than a preset section modification reference value, and determining that the bonding quality is excellent when the section modification value is equal to or greater than the preset section modification reference value.
申请公布号 KR101411937(B1) 申请公布日期 2014.06.26
申请号 KR20130098149 申请日期 2013.08.19
申请人 PEOPLE AND TECHNOLOGY, INC. 发明人 KIM, JUN SUB;ROH, JU SUB;KIM, JUNG MOG;CHAI, JONG HUN
分类号 H01L21/66;H01L21/607 主分类号 H01L21/66
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