| 主权项 |
1. An epoxy resin composition for encapsulation of a semiconductor device, the epoxy resin composition comprising:
an epoxy resin including repeat units represented by Formulae 1 and 2; a curing agent; a curing accelerator; and an inorganic filler, wherein, in Formula 1, R1 and R2 are each independently hydrogen or a linear or branched C1-C5 alkyl group, and a and b are each independently an integer from 0 to 7, wherein, in Formula 2, R1 and R2 are each independently hydrogen or a linear or branched C1-C5 alkyl group, and a and b are each independently an integer from 0 to 4. |
