| 发明名称 |
EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME |
| 摘要 |
The present invention provides an epoxy resin composition for encapsulating a semiconductor device, comprising: an epoxy resin, a curing agent, a curing accelerator, a coupling agent, and an inorganic filler, wherein the coupling agent comprises an alkylsilane compound represented by Formula 1:;wherein R1, R2 and R3 are each independently a C1 to C4 alkyl group, R is a C6 to C31 alkyl group, and n ranges from about 1 to 5 on average. |
| 申请公布号 |
US2014179832(A1) |
申请公布日期 |
2014.06.26 |
| 申请号 |
US201314071781 |
申请日期 |
2013.11.05 |
| 申请人 |
BAE Kyoung Chul |
发明人 |
BAE Kyoung Chul |
| 分类号 |
H01L23/29 |
主分类号 |
H01L23/29 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. An epoxy resin composition for encapsulating a semiconductor device, the composition comprising:
an epoxy resin; a curing agent; a curing accelerator; a coupling agent; and an inorganic filler, wherein the coupling agent includes an alkylsilane compound represented by Formula 1:and
wherein R1, R2, and R3 are each independently a C1 to C4 alkyl group, R is a C6 to C31 alkyl group, and n is about 1 to about 5 on average. |
| 地址 |
Uiwang-si KR |
