RIGID PROBE WITH COMPLAINT CHARACTERISTICS

摘要

A probe and method of probing conduct testing of a circuit. The probe 100 includes a base 110 coupled to a substrate 120. The probe also includes a cantilever 115 attached to the base 110 at a first end, the cantilever 115 deflecting from a first position to a second position in which a second end opposite the first end is in contact with the substrate 120 and to move between the second position and the first position based on movement of a compliant bump 220 of the circuit, and a probe tip 112 attached to the cantilever 115 at the second end, the probe tip maintaining contact with the compliant bump 220 of the circuit.