发明名称 |
HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME |
摘要 |
A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards. |
申请公布号 |
US2014178697(A1) |
申请公布日期 |
2014.06.26 |
申请号 |
US201313834473 |
申请日期 |
2013.03.15 |
申请人 |
CO., LTD. ELITE ELECTRONIC MATERIAL (ZHONGSHAN) |
发明人 |
LI CHANG-YUAN;YU LI-CHIH;PENG HONG-XIA |
分类号 |
H05K1/03 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
1. A halogen-free resin composition, comprising:
(A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. |
地址 |
US |