| 摘要 |
<p>A problem encountered in thermal sensors having an opening and molded from a mold resin is that, due to residual stress of the mold resin at the opening, delamination occurs at an interface where adhesion is weak. This physical quantity sensor has: a semiconductor chip equipped with a detector unit (3); a frame (8a) for mounting the semiconductor chip; a mold resin part (10) for sealing the semiconductor chip and the frame, and having an opening exposing the detector unit to the outside; and a stress absorbing layer (6) situated between a wiring layer formed in the detector unit and an end of the opening in the mold resin part, and comprising a metal material for absorbing stress from the end.</p> |
