| 摘要 |
A capacitor, including a substrate, a first interconnect layer disposed upon the substrate and a first insulating layer disposed on the first interconnect layer. A first metal layer is disposed on the first insulating layer and formed as at least two regions, the at least two regions of the first metal layer connected to the first interconnect layer through vias. A second insulating layer is disposed on the first metal layer. A second metal layer is disposed on the second insulating layer and is formed as at least two regions. The capacitor further includes a third insulating layer disposed on the second metal layer, a second interconnect layer disposed on the third insulating layer and connecting to the at least two regions of the second metal layer through vias. Finally, a first terminal is connected to the first interconnect layer and a second terminal is connected to the second interconnect layer.
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