SEMICONDUCTOR CHIP AND SEMICONDUCTOR APPARATUS WITH EMBEDDED CAPACITOR

摘要

A semiconductor chip includes a semiconductor substrate having one and the other surfaces and formed with a plurality of semiconductor devices; an internal wiring layer having multi-layered internal wiring lines which are formed over the one surface and are electrically connected with the plurality of semiconductor devices, an uppermost internal wiring line among the internal wiring lines being formed with a power supply pad and a ground pad; a dielectric layer formed over the uppermost internal wiring line in such a way as to expose the power supply pad and the ground pad; an external connection reinforcing line formed over the power supply pad or the ground pad which is exposed, and extending onto the dielectric layer; and an embedded capacitor constituted by the external connection reinforcing line, and the dielectric layer and a portion of the is uppermost internal wiring line which correspond to the external connection reinforcing line.

主权项

1. A semiconductor chip comprising:
a semiconductor substrate having a first surface and a second surface and comprising a plurality of semiconductor devices; an internal wiring layer comprising multi-layered internal wiring lines formed over the first surface and electrically connected to the plurality of semiconductor devices, wherein an uppermost internal wiring line among the internal wiring lines is formed with a power supply pad and a ground pad; a dielectric layer formed over the uppermost internal wiring line while exposing the power supply pad and the ground pad; an external connection reinforcing line formed over the power supply pad or the ground pad which is exposed, and extending onto the dielectric layer; and an embedded capacitor comprising the external connection reinforcing line, the dielectric layer, and a portion of the uppermost internal wiring line which correspond to the external connection reinforcing line.