EMBEDDED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

An embedded package of the present invention comprises a package substrate which includes a core with circuit line patterns formed on the outside thereof; a semiconductor chip which is formed on the package substrate; a first connection line pattern which electrically connects the circuit line pattern of the package substrate and the semiconductor chip; an insulating layer which covers the semiconductor chip; a metal pattern which is formed on the insulating layer; and a second connection line pattern which electrically connects the metal pattern and the semiconductor chip.