| 摘要 |
Problem: To provide, in cases where used as a thermally conductive member, particularly as a potting agent or the like of an electronic material, a thermally conductive silicone composition from which a cured product can be obtained that has superior bonding to substrates and is free of cracks, and also to provide a thermally conductive member obtained by curing said composition. Resolution Means: A thermally conductive silicone rubber composition comprising an aluminum hydroxide or magnesium oxide thermally conductive filler having a mass change, measured by thermogravimetric analyses (TGA) before and after being held at 250°C for 30 minutes, of less than 4.0 % by mass; and a thermally conductive member obtained by curing said composition. |
