SEMICONDUCTOR PACKAGE AND DISPLAY DEVICE USING THE SAME

摘要

A semiconductor package includes a flexible base film which has a first surface and a second surface; a semiconductor chip mounted on the first surface of the base film; and a contact detection part adjacent to the semiconductor chip and has a conductive pattern which penetrates the base film and is exposed from the second surface. The contact detection part detects whether or not the base film touches the frame of the display device.