| 发明名称 |
LEAD FRAME HAVING A PERIMETER RECESS WITHIN PERIPHERY OF COMPONENT TERMINAL |
| 摘要 |
Embodiments described herein relate to manufacturing a device. The method includes etching at least one recess pattern in an internal surface of a lead frame, the at least one recess pattern including a perimeter recess that defines a perimeter of a mounting area. The method also includes attaching a component to the internal surface of the lead frame such that a single terminal of the component is attached in the mounting area and the single terminal covers the perimeter recess, wherein the perimeter recess has a size and shape such that the recess is proximate a perimeter of the single terminal. |
| 申请公布号 |
US2014175627(A1) |
申请公布日期 |
2014.06.26 |
| 申请号 |
US201213722063 |
申请日期 |
2012.12.20 |
| 申请人 |
INTERSIL AMERICAS LLC |
发明人 |
Cruz Randolph;Carpenter, JR. Loyde M. |
| 分类号 |
H01L23/495;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a device, the method comprising:
etching at least one recess pattern in an internal surface of a lead frame, the at least one recess pattern including a perimeter recess that defines a perimeter of a mounting area; and attaching a component to the internal surface of the lead frame such that a single terminal of the component is attached in the mounting area and the single terminal covers the perimeter recess, wherein the perimeter recess has a size and shape such that the recess is proximate a perimeter of the single terminal. |
| 地址 |
Milpitas CA US |
