| 发明名称 |
METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, AND CHIP ARRANGEMENT |
| 摘要 |
A method for manufacturing a chip arrangement in accordance with various embodiments may include: placing a chip on a carrier within an opening of a metal structure disposed over the carrier; fixing the chip to the metal structure; removing the carrier to thereby expose at least one contact of the chip; and forming an electrically conductive connection between the at least one contact of the chip and the metal structure. |
| 申请公布号 |
US2014175624(A1) |
申请公布日期 |
2014.06.26 |
| 申请号 |
US201213721337 |
申请日期 |
2012.12.20 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
Palm Petteri |
| 分类号 |
H01L21/50;H01L23/495 |
主分类号 |
H01L21/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a chip arrangement, the method comprising:
disposing a metal structure over a carrier; forming an opening in the metal structure disposed over the carrier; placing a chip on the carrier within the opening of the metal structure disposed over the carrier; fixing the chip to the metal structure; removing the carrier to thereby expose at least one contact of the chip; and forming an electrically conductive connection between the at least one contact of the chip and the metal structure. |
| 地址 |
Neubiberg DE |
