ELECTRONIC COMPONENT PACKAGE AND METHOD FOR PRODUCING SAME

摘要

This method for producing an electronic component package comprises: (i) a step for forming a package precursor, in which an electronic component is embedded in a sealing resin layer such that an electrode of the electronic component is exposed from the surface of the sealing resin layer; (ii) a step for forming a first metal plating layer so that the first metal plating layer is joined with the exposed surface of the electrode of the electronic component; (iii) a step for arranging a metal foil so that the metal foil faces the first metal plating layer at a distance; and (iv) a step for forming a second metal plating layer. In step (iv), the second metal plating layer is formed so that the space between the first metal plating layer and the metal foil is filled therewith, thereby integrating the metal foil, the first metal plating layer and the second metal plating layer with one another.