| 摘要 |
PROBLEM TO BE SOLVED: To inhibit signal delay and deterioration in high-frequency characteristics, and prevent warpage and bubble formation thereby to achieve successful conduction and improve connection reliability.SOLUTION: An electronic component 1 comprises: a semiconductor device 10 including rewiring electrodes 11 formed on at least one surface; an insulation layer 3 which covers an electrode formed surface 11a of the semiconductor device 10 where at least the rewiring electrodes 11 are formed; and diagonal wiring conductors 12 composed of bonding wires 13 which pierce the insulation layer 3 and have one ends connected to the rewiring electrodes 11 of the semiconductor device 10 by wire bonding and other ends exposed on a surface 3a of the insulation layer 3 on the side opposite to the semiconductor device 10 side to form electrodes 12a at a pitch larger than an arrangement pitch of the rewiring electrodes 11. |
