Components with near-surface cooling microchannels and methods for providing the same

摘要

Methods for providing a near-surface cooling microchannel (32) in a component (10) include forming a near-surface cooling microchannel (30) in a first surface (36) of a pre-sintered preform (30), disposing the first surface (36) of the pre-sintered preform (30) onto an outer surface (26) of the base article (20) such that an opening (24) of the outer surface (26) of the base article (20) is aligned with the near-surface cooling microchannel (32) in the first surface (36) of the pre-sintered preform (30), and, heating the pre-sintered preform (30) to bond it to the base article (20), wherein the opening (24) of the outer surface (26) of the base article (20) remains aligned with the near-surface cooling microchannel (32) in the first surface (36) of the pre-sintered preform (30).