| 摘要 |
A multichip module comprising: a base substrate; a wiring board disposed on the base substrate and having a wiring pattern; an adhesive layer configured to bond the base substrate to the wiring board while maintaining an electrical connection between the base substrate and the wiring board; and a plurality of chips connected to a surface of the wiring board, the surface being opposite the adhesive layer, wherein, assuming that α is a coefficient of thermal expansion of the wiring board, &bgr; is a coefficient of thermal expansion of the base substrate, and γ is a coefficient of thermal expansion of the adhesive layer, the relationship α<γ<&bgr; is satisfied. |
