| 摘要 |
The present invention provides a ball filling device (10). The device (10) is operated, in a condition that a mask (111) for disposing conductive balls (B) into a plurality of openings (111) defined in a substrate (100) is positioned on the substrate (100), to fill the conductive balls (B) into the plurality of openings (111), and comprises a plurality of heads (21a, 21b) that respectively retain independent groups (Bg1, Bg2) of plural conductive balls on a plurality of portions of a surface (111a) of the mask (110), and a head moving mechanism (30) for moving the plurality of heads (21a, 21b) to have the groups (Bg1, Bg2) of plural conductive balls moving on the surface (110a) of the mask (110). |
